Brill E-Books

 Electrically Conductive Adhesives

Contents

• • Preliminary Material (i-viii)   (60K)
    • Jump to section:
    • Contents
    • Preface
  • Using Electrically Conductive Inks And Adhesives As A Means To Satisfy European PCB Manufacturing Directives (1-24)   (4M)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction
    • 2. An Alternative Method Of Manufacturing A Single-Sided PCB
    • 3. Testing Boards To Existing Standards
    • 4. Discussion
    • 5. Conclusion
    • References
  • An Overview Of The Use Of Electrically Conductive Adhesives (ECAs) As A Solder Replacement (25-38)   (2M)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Electrically Conductive Adhesives
    • 3. Electrical Properties Of Electrically Conductive Adhesives
    • 4. Mechanical Properties Of Electrically Conductive Adhesives
    • 5. Utilisation Of Conductive Adhesives As A Solder Replacement
    • 6. Manufacturing Parameters
    • 7. Summary Of Electrically Conductive Adhesives
    • References
  • Electrically Conductive Adhesives For Electronic Packaging And Assembly Applications (39-56)   (4M)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Paste (ECA) Formulation, Characteristics And Behavior
    • 3. Summary
    • Acknowledgements
    • References
  • Anisotropic Conductive Adhesives For Flip-Chip Interconnects (57-78)   (4M)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction
    • 2. ACF Bonding Process
    • 3. Contact Resistance Of ACF Joints
    • 4. Adhesion Strength Of ACF Joints
    • 5. Reliability Test Of ACF Joints
    • 6. Conclusions
    • References
  • Review Of Recent Advances In Electrically Conductive Adhesive Materials And Technologies In Electronic Packaging (79-116)   (2M)
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    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Isotropic Conductive Adhesives (ICAs) For Electronic Packaging
    • 3. Anisotropic Conductive Adhesives (ACAs) For Electronic Packaging
    • 5. Conclusion
    • References
  • Recent Advances In Developing High Performance Isotropic Conductive Adhesives (117-134)   (2M)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction To Conductive Adhesive Technology
    • 2. Electrical Conductivity Of ICAs
    • 3. Contact Resistance Of ICA Joints
    • 4. Impact Performance
    • 5. Summary
    • References
  • Recent Advances In Nano-Conductive Adhesives (135-154)   (1M)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Recent Advances In Nano-Isotropic Conductive Adhesives (Nano-ICAs)
    • 3. Recent Advances In Nano-ACAs/ACFs
    • 4. Summary
    • References
  • Reliability Of Anisotropic Conductive Adhesive Joints In Electronic Packaging Applications (155-184)   (792K)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Effect Of Bonding Process On The Reliability Of ACA Joints
    • 3. Effects Of Environmental Factors On The Reliability Of ACA Joints
    • 4. Effects Of The Properties Of Components
    • 5. Summary Conclusions
    • Acknowledgements
    • References
  • Drop Test Performance Of Isotropic Electrically Conductive Adhesives (185-202)   (3M)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Experimental
    • 3. Results
    • 4. Discussion
    • 5. Summary And Conclusions
    • Acknowledgements
    • References
  • Mechanics Of Adhesively Bonded Flip-Chip-On-Flex Assemblies. Part I: Durability Of Anisotropically Conductive Adhesive Interconnects (203-226)   (5M)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Experimental Approach
    • 3. Test Results
    • 4. Modeling
    • 5. Summary And Conclusions
    • 6. Future Work
    • Acknowledgements
    • References
  • Mechanics Of Adhesively Bonded Flip-Chip-On-Flex Assemblies. Part II: Effect Of Bump Coplanarity On Manufacturability And Durability Of Non-Conducting Adhesive Assemblies (227-250)   (2M)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction
    • 2. FCOF Architectures
    • 3. Modeling Approach And Results
    • 4. Summary And Conclusions
    • Acknowledgement
    • References
  • Fatigue Behavior Of Electrically Conductive Adhesives (251-270)   (4M)
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    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Experimental Procedure
    • 3. Results And Discussion
    • 4. Summary
    • Acknowledgements
    • References
  • Aspect Ratio And Loading Effects Of Multiwall Carbon Nanotubes In Epoxy For Electrically Conductive Adhesives (271-284)   (3M)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Experimental
    • 3. Results And Discussion
    • 4. Conclusions
    • Acknowledgements
    • References
  • Novel Techniques For Characterization Of Fast-Cure Anisotropic Conductive And Non-Conductive Adhesives (285-300)   (766K)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Experimental
    • 3. Results And Discussion
    • 4. Conclusion
    • Acknowledgements
    • References
  • Chemorheology Of Epoxy/Nickel Conductive Adhesives During Processing And Cure (301-326)   (1M)
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    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Experimental
    • 3. Results And Discussion
    • 4. Conclusions
    • References
  • Temperature Characterization In Anisotropic Conductive Film Adhesive Bonding (327-344)   (623K)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Measurement Of ACF Bonding Temperature
    • 3. Thermal Modeling Simulation Details Of Computational Design
    • 4. Thermal Modeling Simulations Of ACF Bonding Temperatures
    • 5. Summary And Conclusions
    • References
  • Operating Temperature Of Anisotropic Conducting Film Adhesives (345-356)   (259K)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Model
    • 3. Analysis And Discussion
    • 4. Conclusions
    • Acknowledgement
    • References
  • Geometric Effects On Multilayer Generic Circuits Fabricated Using Conductive Epoxy/Nickel Adhesives (357-366)   (1M)
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    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Experimental
    • 3. Results And Discussion
    • 4. Conclusions
    • References
  • Stable And Unstable Capillary Flows Of Highly-Filled Epoxy/Nickel Suspensions (367-386)   (3M)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Experimental
    • 3. Results And Discussion
    • 4. Conclusions
    • References
  • Electrical Properties Of Copper-Filled Electrically Conductive Adhesives And Pressure-Dependent Conduction Behavior Of Copper Particles (387-410)   (4M)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Experimental
    • 3. Results And Discussion
    • 4. Conclusion
    • Acknowledgement
    • References
  • Experimental Investigation And Micropolar Modelling Of The Anisotropic Conductive Adhesive Flip-Chip Interconnection (411-426)   (2M)
    • Jump to section:
    • Abstract
    • Keywords
    • 1. Introduction
    • 2. Experimental Details
    • 3. Experimental Results And Discussion
    • 4. Micropolar Model And Simulation
    • 5. Concluding Remarks
    • Acknowledgements
    • References